Samsung Electronics Executive Chairman Lee Jae-yong visited the company’s advanced chip-packaging research lab in Yokohama, Japan, on Sunday, reviewing technology progress and discussing closer cooperation with local suppliers, according to Samsung Electronics as reported by Hankyoreh and The Korea Times.
- Samsung Executive Chairman Lee Jae-yong visited the Advanced Package Lab (APL) in Yokohama, Japan, on Sunday, according to Hankyoreh and The Korea Times.
- APL began operating in 2023 and held its official opening ceremony on September 8 this year, per Hankyoreh and Korea Times.
- Samsung Electronics has been investing 40 billion yen (about $254 million) over five years starting in 2024 to build the lab's research infrastructure, according to Korea Times.
- Lee was accompanied by Kawahira Hiroichi, vice president and head of DS Research Japan, and Kariya Takashi, the executive director leading APL, per Hankyoreh.
- Last month, Lee reportedly called Samsung's chip division head Jeon Young-hyun and devices division head Roh Tae-moon to Japan for a related meeting, according to Hankyoreh.
What happened
Lee toured the Advanced Package Lab (APL), accompanied by Kawahira Hiroichi, vice president and head of DS Research Japan, and Kariya Takashi, the executive director who leads APL, Hankyoreh reported. During the visit, Lee checked on the development of materials and process technologies used in advanced semiconductor packaging and spoke with researchers about expanding ties with Japan’s materials, parts and equipment companies, according to the outlet. The Korea Times added that Lee pledged to keep growing APL’s research staff and to turn it into a global hub for next-generation packaging work.
The trip followed an earlier gathering last month, when Lee reportedly summoned Samsung’s semiconductor division head Jeon Young-hyun and its devices division head Roh Tae-moon to Japan for discussions, Hankyoreh noted.
Why it matters
Advanced packaging involves combining different chip components — such as GPUs, high-bandwidth memory, and accelerator chips — into a single package. This step directly affects how an AI system performs in terms of data bandwidth, power efficiency, and heat management, according to Hankyoreh. As global demand for AI processors rises, packaging technology is increasingly seen as being just as important as chip fabrication itself.
Lee reportedly stressed that securing strong packaging capabilities is critical, since these techniques are becoming central to competitiveness in AI processor chips, according to Korea Times.
Background
APL began operating in 2023 and held its formal opening ceremony on September 8 this year, according to both Hankyoreh and Korea Times. Samsung Electronics said it has been investing 40 billion yen, roughly $254 million, over five years starting in 2024 to build research infrastructure in Japan and strengthen its packaging technology, Korea Times reported.
The lab is meant to connect Samsung’s chip design and manufacturing operations with Japan’s network of materials, parts, and equipment suppliers, including firms like Tokyo Electron and Ibiden, according to Hankyoreh. APL’s research focus differs from that of the packaging unit at Samsung’s Semiconductor R&D Center in Korea, and the two teams plan to coordinate closely for added synergy, Korea Times reported.
Samsung also pointed to Japan’s government support for the semiconductor and AI sectors as a reason the country remains an attractive base for packaging research and local partnerships, according to a company statement cited by Hankyoreh. More broadly, Japan has long been home to a dense network of specialized chip equipment and materials makers, giving global chipmakers access to an established supply chain even as the country builds fewer leading-edge chip factories than some competitors.
What to watch
Future signals to track include whether APL expands its headcount and research scope as Samsung has indicated, and whether the company deepens its sourcing relationships with Japanese materials and equipment firms. Our read: the visit suggests Samsung sees packaging technology, not just transistor miniaturization, as a key front in the broader AI chip race, with Japan’s supplier base playing a growing part in that strategy. Additional announcements on investment levels, staffing, or specific technology milestones at APL would offer clearer evidence of how quickly this approach is advancing.
Frequently asked questions
What is Advanced Package Lab (APL)?
APL is Samsung Electronics' semiconductor packaging research site in Yokohama, Japan, that develops and tests materials and process technologies for advanced chip packaging, according to Hankyoreh and Korea Times.
How much has Samsung invested in the Japan lab?
Samsung Electronics has been investing 40 billion yen, about $254 million, over five years starting in 2024 to build research infrastructure there, per Korea Times.
Why does packaging matter for AI chips?
Advanced packaging combines components like GPUs, high-bandwidth memory, and accelerator chips into a single unit, directly shaping an AI system's bandwidth, power efficiency, and heat performance, according to Hankyoreh.
Sources
- The Hankyoreh: 삼성 이재용, 일본 반도체 패키징 연구거점 찾아…“현지 협력 확대”
- The Korea Times: Samsung chairman highlights chip packaging, visits Japanese unit
This article was prepared with AI assistance from the reports listed above and automatically checked against them. See About for how we work.